"Requested_prod_id","Requested_GTIN(EAN/UPC)","Requested_Icecat_id","ErrorMessage","Supplier","Prod_id","Icecat_id","GTIN(EAN/UPC)","Category","CatId","ProductFamily","ProductSeries","Model","Updated","Quality","On_Market","Product_Views","HighPic","HighPic Resolution","LowPic","Pic500x500","ThumbPic","Folder_PDF","Folder_Manual_PDF","ProductTitle","ShortDesc","ShortSummaryDescription","LongSummaryDescription","LongDesc","ProductGallery","ProductGallery Resolution","ProductGallery ExpirationDate","360","EU Energy Label","EU Product Fiche","PDF","Video/mp4","Other Multimedia","ProductMultimediaObject ExpirationDate","ReasonsToBuy","Spec 1","Spec 2","Spec 3","Spec 4","Spec 5","Spec 6","Spec 7","Spec 8","Spec 9","Spec 10","Spec 11","Spec 12","Spec 13","Spec 14","Spec 15","Spec 16","Spec 17","Spec 18","Spec 19","Spec 20","Spec 21","Spec 22","Spec 23"
"","","264758","","HP","378748-B21","264758","","Prosesor","989","","","Intel Xeon 3GHz","20240307153452","ICECAT","1","111952","https://images.icecat.biz/img/gallery/18145629_9932.jpg","450x400","https://images.icecat.biz/img/gallery_lows/18145629_9932.jpg","https://images.icecat.biz/img/gallery_mediums/img_18145629_medium_1479821537_297_3554.jpg","https://images.icecat.biz/img/gallery_thumbs/18145629_9932.jpg","","","HP Intel Xeon 3GHz prosesor 2 MB L2","","HP Intel Xeon 3GHz, Intel® Xeon®, Socket 604 (mPGA604), 90 nm, 3 GHz, 64-bit, Server / workstation","HP Intel Xeon 3GHz. Keluarga prosesor: Intel® Xeon®, Soket prosesor: Socket 604 (mPGA604), Litografi prosesor: 90 nm. Segmen pasar: Server, Sejumlah Processing Die Transistors: 169 M, Ukuran Die Processing: 135 mm². Ukuran paket prosesor: 42.5 mm","","https://images.icecat.biz/img/gallery/18145629_9932.jpg","450x400","","","","","","","","","","Prosesor","Keluarga prosesor: Intel® Xeon®","Inti prosesor: 1","Soket prosesor: Socket 604 (mPGA604)","Litografi prosesor: 90 nm","Frekuensi dasar prosesor: 3 GHz","Modus pengoperasian prosesor: 64-bit","Komponen untuk: Server / workstation","Cache prosesor: 2 MB","Tipe cache Prosesor: L2","Bus bagian depan prosesor: 800 MHz","Thermal Design Power (TDP): 110 W","Rentang tegangan VID: 1,2875 - 1,3875 V","Grafik","Adaptor grafis pada papan induk: Tidak","Fitur","Segmen pasar: Server","Sejumlah Processing Die Transistors: 169 M","Ukuran Die Processing: 135 mm²","Operational conditions","Tcase: 72 °C","Berat dan dimensi","Ukuran paket prosesor: 42.5 mm"